NanoFinish Corporation
Precision Polishing for Semiconductor Wafers

Semiconductor Wafer Polishing

Semiconductor Polishing

Chemical Mechanical Polishing (CMP) is a surface finishing process which combines a polishing pad surface with an abrasive, where the abrasive also provides a chemcial contribution. By properly optimizing the chemical contribtuion with the mechanical removal, the flatness and surface finish for sub 0.5 micron devices can be greatly improved.

For semiconductor polishing CMP polishing is used to remove damage to the silicon, GaAs or SiC wafers. It is also used to remove the damascence overdeposited copper.

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